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Microscopy Analysis

Microscopy Analysis Testing Techniques

Microscopy analysis provides the high-resolution imaging and elemental insight needed to understand microstructure, validate quality, and pinpoint the root causes of defects and failures. At Lucideon, we combine Scanning Electron Microscopy (SEM) with Energy-Dispersive Analysis (EDA/EDS/EDX) for detailed imaging and elemental mapping, and Optical Microscopy for rapid, standards-based examination of prepared cross-sections and surfaces. Together, these techniques deliver clear evidence to support product development, troubleshooting, and compliance across metals, ceramics, polymers, composites, coatings and natural materials. We also deploy Field Emission Scanning Electron Microscopy (FEG-SEM) for ultra-high-resolution imaging and improved surface sensitivity at low accelerating voltages, enabling confident characterisation of fine features, thin films and delicate interfaces.

Why choose Lucideon for microscopy?

  • SEM-EDA/EDS elemental insight: High-resolution imaging with spatially resolved elemental identification and mapping to locate inclusions, contaminants, and interfacial issues
  • Optical Microscopy for fast, standardised checks: Metallography, petrography to reveal grain structure, phases, porosity, cracks and coating integrity in polished sections
  • End-to-end problem solving: We link microscopy results with wider materials testing and consultancy (e.g., failure analysis, particulate analysis, surface chemistry) for actionable recommendations
  • FEG-SEM: Sharper detail at nano- to micro-scale, superior imaging at low kV, better charge control on non-conductive samples, and enhanced contrast for ultra-fine features and surface films

Our microscopy techniques

Scanning Electron Microscopy with Energy-Dispersive Analysis (SEM-EDA/EDS/EDX) High-magnification imaging of fracture surfaces, particles and interfaces, combined with elemental analysis and mapping. Ideal for failure analysis, coating and surface investigations, particulate/contamination identification, and microstructural characterisation. See our dedicated SEM-EDX page for more detail.

Field Emission Scanning Electron Microscopy (FEG-SEM)
Next-generation SEM that uses a field-emission electron source to deliver higher spatial resolution, tighter probe size, and excellent low-kV performance. FEG-SEM is particularly powerful for nanoscale features (e.g., precipitates, nano-fillers, catalyst supports), thin films and coatings (morphology, defects, interfaces), polymers, ceramics and other low-conductivity materials that benefit from gentle imaging conditions, high-definition fractography and fine-crack assessment

Optical Microscopy (Metallography & Petrography) Reflected/transmitted-light imaging to assess grain size, phases, inclusions, layer thickness, porosity, cracks, corrosion, and coating adhesion. Applied across engineering alloys, ceramics, concretes and natural stone.

What we solve with microscopy

  • Failure & fractography: determine whether cracking is brittle, ductile, intergranular or fatigue-related; confirm root causes such as inclusion-initiated failures or under-film corrosion
  • Coating integrity & interfaces: measure layer thickness, evaluate adhesion, identify contamination or chemistry changes at interfaces via SEM-EDS mapping
  • Particulates & contamination: identify and source foreign particles affecting performance or cleanliness (e.g. medical devices, electronics, clean manufacturing)
  • Mineralogy & construction materials: characterise aggregates, cements and concrete microstructure; diagnose durability issues
  • Nanoscale & surface-sensitive problems: use FEG-SEM to resolve ultra-fine features, surface films and near-surface defects that are beyond the reach of conventional SEM

Deliverables you can receive

  • Decision-ready report with annotated micrographs, elemental spectra (for SEM-EDS), measurement data and clear conclusions
  • Root-cause analysis linking evidence to mechanisms
  • Practical recommendations for materials selection, surface preparation, coating/application controls, or process changes - so you can prevent recurrence and improve reliability

Related Lucideon services

  • SEM-EDX (Scanning Electron Microscopy & EDX Analysis) - technique overview and applications
  • FEG-SEM - advanced SEM capability for ultra-high-resolution work
  • Surface Analysis - complementary near-surface chemistry (e.g., XPS, 3D SEM)
  • Failure Analysis - integrated investigations for engineering and building materials
  • Particulate Analysis - particle identification and quantification workflows
  • Metallography - sample preparation and optical methods